Mechanical Behavior of Materials and Structures in Microelectronics
Mechanical Behavior of Materials and Structures in Microelectronics
Volume 226:
Series:
Editors:
Ephraim Suhir, AT&T Bell Laboratories, New Jersey
Robert C. Cammarata, The Johns Hopkins University
Deborah D. L. Chung, State University of New York, Buffalo
Masahiro Jono, Osaka City University, Japan
Robert C. Cammarata, The Johns Hopkins University
Deborah D. L. Chung, State University of New York, Buffalo
Masahiro Jono, Osaka City University, Japan
Semyon Vaynan, Morris E. Fine, J. K. Tien, A. I. Attarwala, Yi-Hsin Pao, Kuan-Luen Chen, An-Yu Kuo, Cynthia M. Melton, Susan M. Yarling, Carl J. Raleigh, Wang Chunqing, Qian Yiyu, Jiang Yihong, Tomohiro Uno, K. Tatsumi, K. Mizuno, O. Kitamura, Y. Ohno, Fang Hongyuan, C. P. Wong, A. Bar-Cohen, Devin E. Mix, Mingguang Zhu, D. D. L. Chung, R. R. Lagasse, R. S. Chambers, T. R. Guess, D. J. Plazek, C. Bero, Boon Wong, David C. Sandkulla, Kun Tong, Jeffrey E. Taylor, Richard J. Farris, A. S. Jordan, V. Swaminathan, S. M. Prokes, Jun Ming Hu, Michael Pecht, Donald Barker, Tetsuya Ohashi, Naoyuki Honda, Jeng-Maw Chiou, J. G. Huang, R. J. Jaccodine, J. H. Huang, S. A. Schwarz, C. L. Schwartz, R. Bhat, T. W. Wu, B. S. Berry, W. C. Pritchet, Si Kamakhya P. Ghatak, Badal De, A. Jagota, M. F. Lemon, Y. H. Hu, Tsann Lin, V. Raman, M. Grant Norton, Paul G. Kotlua, Jian Li, Stuart McKernan, Kathryn P. B. Cracknell, C. Barry Carter, James W. Mayer, P. H. Townsend, T. M. Stokich, Jr, B. S. Huber, B. Yost, Che-Yu Li, Bette Bergman-Reuter, Tim Sullivan, Sarah E. Bobbin, J. W. Wagner, R. C. Cammarata, R. R. Kola, G. K. Celler, R. Ramesham, T. Roppel, C. Ellis, H. S. Koo, T. L. Kuo, D. H. Kuo, R. J. Lin, W. H. Lee, P. T. Wu, H. G. Bohn, W. Pill, K.-H. Robrock, W. Schilling, C.-K. Kwok, E. Kolawa, M. A. Nicolet, Ray C. Lee, E. Suhir, W. W. Gerberich, J. E. Angelo, R. R. Keller, A. W. Wowchak, P. I. Cohen, L. B. Freund, K. S. Kim, Masahiro Jono, Atsushi Sugeta, A. Chudnovsky, C. P. Bosnyak, C. S. Chen, Ronald E. Allred, William E. Warren, Guo-Quan Lu, Boris Mogilevsky, Tapan K. Gupta, Hideo Miura, Hiroshi Sakata, Shinji Sakata, J. Marschall, F. Milstein, G. Georgeson, V. Gerrish, David L. Davidson, C. C. Chao, R. Chleboski, E. J. Henderson, C. K. Holmes, J. P. Kalejs, T. S. Gross, M. Muraoka, H. Abé, V. N. Belomestnykh, O. L. Khasanov, Yu.P. Pokholkov, A. A. Bush, Beta Y. Ni, T. Y. Zhang, J. C. M. Li, M. A. Korhonen, P. Børgesen, C. Basa, W. R. LaFontaine, B. Land, J. K. Lee, C. A. Paszkiet, T. Nakagawa, H. Miyatake, T. Maeda, K. Kuroda, N. Tokushige, R. Inoue, J. Kudo, T. Ashida, R. G. Ross, Jr, L. C. Wen, G. R. Mon, E. Jetter, J. Winslow, L. G. Burrell, S. Kapur, I. Shareef, A. M. Conlon, C. P. Cameron, J. W. Lau
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Reprinted:
June 2014
Volume:
226
Published:
January 1991
Format:
Paperback
ISBN:
9781107409866
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Hardback
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Product details
January 1991Hardback
9781558991200
472 pages
229 × 152 × 25 mm
0.79kg
Available
Table of Contents
- Part I. Metals
- Part II. Organic Materials
- Part III. Semiconductors
- Part IV. Thin Films and Coatings
- Part V. Stress-Strain and Fracture Analyses
- Part VI. Reliability Issues.
