Wireless Interface Technologies for 3D IC and Module Integration

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

• Includes a comprehensive description of how the changing computing requirements and evolving performance constraints in IC design have co-evolved
• Provides intuitive explanations of the design principles and trade-offs of near-field wireless interface technologies for 2.5-3D IC and module integration
• Presents verified implementation examples for a wide range of popular applications including wideband DRAM, 3D NoC, smartphones, automotive systems, SSD, satellite processor systems, multi-drop memory bus and backplane, and stacked memory for neural networks